Wireless
ByteSnap Design Release ZigBee ZMM-001 Module - Low Power ZigBee Smart Energy Module Targets Metering and Control
The industry's first ever ZigBee® Certified Smart Energy compliant module to combine three key features: lower power, faster deployment and trouble-free compliance with wireless standards. (Patent Pending)
SMSC Introduces KleerNet(TM) Technology to Expand Wireless Audio Connectivity and Interoperability in PC, Tablet, Home Theater, and Gaming Applications
SMSC is showcasing its Kleer(R) uncompressed digital wireless audio technology at the Computex event taking place from May 31 to June 4 in Taipei, Taiwan. Kleer technology is recognized in the wireless audio industry for its high quality media transmission, low power consumption, strong interference robustness and Wi-Fi(R) coexistence. SMSC's Kleer product portfolio offers best-in-class solutions that deliver high quality wireless audio connectivity at home, in the office, or on-the-go.
Telit touts EV-DO m2m module ideal for commercial and consumer applications
DE910-DUAL Brings 3G CDMA Connectivity and GPS Capability in a new LGA Form Factor Family
Silicon Labs and CEL partner on high-performance, low-power wireless mesh networking solution
Silicon Laboratories Inc. has announced that it is providing the enabling wireless microcontroller (MCU) technology for a new line of sub-GHz wireless mesh networking modules from California Eastern Laboratories (CEL). Powered by Silicon Labs' Si10xx wireless MCUs, the MeshConnect Sub-G modules are CEL's first module series optimized for wireless applications in the sub-GHz ISM band including smart meters, home automation, security systems, remote keyless entry, irrigation control and weather stations.
RF Engines Releases ChannelCore FlexTM - the World's Most Flexible Ultra-Wideband Channelizer Solution
High-performance, feature rich Channelizer addresses demands of next generation Electronic Surveillance, Satcoms and Wireless Base Station applications
Broadcom Ignites Innovation With PC Industry's First 40nm Wi-Fi and Bluetooth Combo Chip
InConcert® Combo Chip Simplifies Connectivity for PCs, Notebooks and Netbooks, Enables Innovative Android and Windows-Based Wireless Applications
Broadcom Boosts InConcert® Connectivity Portfolio With Bluetooth® Innovations for PCs, Set-Top Boxes and Consumer Electronics
New Bluetooth Low Energy and Enhanced Data Rate Solutions to Enable More Imaginative User Experiences
TI sets new tune for wireless digital audio streaming, unveils industry's first complete wireless headset reference design
PurePath™ Wireless CC8530 device drives multichannel audio streaming on up to four channels, new headset reference design achieves 100 percent battery life increase as compared to current offerings
Anritsu Company Redefines Broadband VNA Market with Introduction of ME7838A
Anritsu Company introduces the ME7838A broadband vector network analyzer (VNA) system that provides single-sweep coverage from 70 kHz to 110 GHz with operation from 40 kHz to 125 GHz, and utilizes an advanced design that eliminates the need for large, heavy millimeter wave (mmWave) modules and coax combiners.
Toshiba Expands GaN HEMT Product Family with Power Amplifier for Extended Ku-Band Satcom Applications
This week at the 2011 IEEE MTT-S International Microwave Symposium, Toshiba America Electronic Components, Inc. (TAEC*) and its parent company, Toshiba Corp., announced the TGI1314-25L, a gallium nitride (GaN) semiconductor High Electron Mobility Transistor (HEMT), the latest addition to its power amplifier product family.
New functions for the compact broadband amplifier system from Rohde & Schwarz
Rohde & Schwarz adds new functions to its R&S BBA100 broadband amplifier family to create a one-box solution. Integrated RF output switches and sample port switches allow the amplifiers to be used for many applications without the need for external switching matrices. Existing third-party amplifiers can also be integrated into the R&S BBA100 system. The modular design allows users to combine many functions into a compact EMC broadband amplifier system that is perfectly tailored to their requirements. The R&S BBA100 is ideal for EMC applications in test houses as well as in the electronics and automobile industry.
Triquint Semiconductor, Agilent Technologies collaborate on next-generation wireless design flow
TriQuint Semiconductor have announced results for building next-generation RF solutions. This includes enhanced TriQuint process design kits with support for Agilent's Advanced Design System 2011 EDA software and the development of an ADS RF Module PDK for TriQuint's RFIC/MMIC and RF Module integrated design flow.
Harvest Energy from a Single Photovoltaic Cell
To simplify the distribution of wireless communications for instrumentation, monitoring and control applications, power supply designers strive for device grid-independence. Batteries, the immediately obvious solution, offer the illusion of grid independence, but require replacement or recharging, which means eventual connection to the grid and expensive human intervention and maintenance. Enter energy harvesting, where energy is collected from the instrument's immediate environment, offering perpetual operation with no connection to the grid and minimal or no maintenance requirements.
Cree Demonstrates Industry’s First C-Band GaN HEMT MMIC High-Power Amplifier for Satellite Communications
Cree, Inc. will demonstrate the industry's first GaN HEMT MMIC high power amplifier (HPA) for satellite communication applications at the 2011 IEEE International Microwave Symposium held June 7-9 in Baltimore. The demonstration product offers dramatic performance improvements over existing commercially-available GaAs MESFET transistors or Traveling Wave Tube-based amplifiers.
Ultra-Broadband double-balanced mixer
The M4-10M10 features 10 MHz to 10 GHz ultra-broadband LO/RF performance, making it unique in the M4 mixer family.
Atheros Introduces Industry’s Most Advanced Dual-Band, Dual-Stream Wi-Fi Chip for High Performance Audio Visual Consumer Experiences
AR9374 Chip Offers 2x2 Dual-Band 802.11n MIMO Solution and 40MHz Transmissions to Support High Data-Rate USB and Embedded CE Applications
Small SMT Mountable 3G Module
The SIM5320E from SIMCom is dual-band HSDPA/WCDMA and quad-band GSM/GPRS/EDGE module solution in a SMT type which supports HSDPA up to 3.6Mbps for downlink data transfer.
Avago Technologies Introduces Market's First WiMAX Coexistence Front-End Module for Simplified Design of Mobile Electronics
Highly-Integrated, Small-Footprint Module Delivers Best-in-Class Noise Rejection; Provides Complete RF Front-End Solution for Streamlined Time to Market
Avago Debuts Integrated Switch and Low-Noise Amplifier Modules for TD-SCDMA and TD-LTE Base Stations
Compact, Fully-Matched Solutions Replace Three Discrete Devices to Save PCB Space, While Delivering Superior Noise Figure, Linearity and Power Handling Performance
WAGO Bluetooth® ETHERNET Gateway
WAGO Corporation's new 758-915 Bluetooth® ETHERNET Gateway wirelessly transfers ETHERNET protocols, such as PROFINET, MODBUS/TCP or EtherNet/IP via Bluetooth® 2.0. Replacing communication lines between two automation systems, 758-915 features a 400 meter range courtesy of an international, license-free 2.4–2.480 GHz ISM band. This is ideal for mobile applications or those where cable-based data transmission would be too costly, complex or impossible.
RFMD Expands Portfolio of Broadband Components With New IQ Modulators Featuring Integrated Local Oscillators
RF Micro Devices, Inc. has announced it has extended its portfolio of broadband components to include two new low power IQ Modulators featuring integrated fractional-N synthesizers and voltage controlled oscillators (VCO).
Ultra-Broadband Conical Inductors
New "C" conical series leverages Gowanda's proprietary processes and expertise, and addresses market need for more standard and custom design options for communication applications
HIGH-SPEED DATA CONVERTERS AND IF DIVERSITY RECEIVERS FROM ADI MAXIMIZE RECEIVER SENSITIVITY AND DYNAMIC RANGE FOR 3G AND 4G CELLULAR BASE STATIONS
Analog Devices, Inc. have introduced four high-speed data converter products that support signal sampling rates necessary to accommodate multi-carrier radio platform requirements for today's 3G and 4G cellular infrastructure communication standards, including CDMA2000, UMTS/LTE, TD-SCDMA and TD-LTE.
Redpine Signals Launches Industry's First Simultaneous Dual-band and High Performance 450 Mbps 3x3 802.11n Chipset for Digital Home and Enterprise Applications
Maxi-Fi® BEAM450™ chipsets achieve industry leading 802.11n performance with advanced features like MIMO ML decoding, transmit beamforming and simultaneous dual-band
Qualcomm Atheros Announces Highly Integrated Connectivity Solution for Superior Performance in Smartphones and Tablets
WCN3660 Combo Chip Brings Dual-band Wi-Fi, Bluetooth and FM Radio Connectivity to Qualcomm's 28nm Snapdragon Family of Mobile Processors
Qualcomm Atheros and Wilocity Announce Tri-band Wi-Fi: Industry’s First Standards-compliant, Multi-gigabit Wireless Chipset
Qualcomm Atheros Inc., and Wilocity today announced the ,AR9004TB the industry's first tri-band Wi-Fi chipset that integrates the multi-gigabit performance of in-room 60 GHz band with seamless handoff to 2.4 GHz and 5 GHz band Wi-Fi. The new AR9004TB solution is the first chipset capable of supporting a wide range of applications, from I/O to video to networking, at the same speeds as equivalent wired connectivity technologies, while maintaining whole home coverage and complete interoperability.
Atheros Raises the Standard for Wi-Fi/Bluetooth Combo Solutions
Extends Most Popular Computing Portfolio with World's First Monolithic Combo of 2-Stream, Dual-Band 802.11n and Bluetooth 4.0 for Tablets, Notebooks and Netbooks
Hittite Adds Two Variable Gain Amplifiers for Wideband Applications
Hittite Microwave Corporation has introduced two new Digital Variable Gain Amplifiers (VGA) which are ideal for automotive, broadband, cellular/3G, WiMAX/4G, test & measurement equipment and military applications between 500 MHz and 6 GHz.
Silicon Labs Powers Wireless Networking Solution with Energy Harvesting System
Silicon Laboratories Inc. has introduced the industry's most energy-efficient wireless sensor node solution powered by a solar energy harvesting source. The new turnkey energy harvesting reference design enables developers to implement self-sustaining, ultra-low-power wireless sensor networks for home and building automation, security systems, industrial control applications, medical monitoring devices, asset tracking systems and infrastructure and agricultural monitoring systems.
Skyworks Unveils Family of Broadband Quadrature Modulators for Cellular Infrastructure Market
Skyworks Solutions, Inc. has introduced three wideband quadrature modulators for cellular infrastructure and high performance radio link applications. Skyworks' modulators are the latest additions to its wireless infrastructure portfolio and designed to support the world's leading 3G and 4G base station providers.
Technical overview of the PFT architecture and comparisons against FFT & digital frequency converter techniques
This paper gives an outline description of the Pipelined Frequency Transform (PFT) hardware architecture, which was developed as an answer to the problem of channelising very wideband (80MHz+) signals.
Laird Technologies Releases Enhanced Bluetooth® BTM510/511 and BTM520/521 Wireless Stereo Audio Modules with New Firmware Update
Laird Technologies, Inc., today announced for the release of its enhanced Bluetooth® BTM510/511and BTM520/521 wireless stereo audio modules with new firmware update.
CSR CD-Quality audio enhances user experience for new Samsung Bluetooth stereo headset
CSR plc today announced that its innovative aptX™ high-fidelity audio compression technology is a key feature in the new Samsung HS3000 Bluetooth Stereo headset, enabling Samsung to create a Bluetooth headset offering wireless stereo audio quality that is virtually indistinguishable from that of wired stereo audio devices.
New Tensilica IP Core Targeted to Dataplane and Signal Processing Functions Such as Imaging, Communications and Networking, Boost Data Bandwidth 4X
Tensilica, Inc. has announced that it is extending its leadership in IP cores for compute-intensive dataplane and DSP functions such as imaging, video, networking and baseband wired/wireless communications. Any application that requires extensive data processing will significantly benefit from the breakthrough features - particularly those that quadruple data bandwidth - built into Tensilica's new Xtensa LX4 dataplane processor (DPU) for SOCs (system-on-chips).
PLX First to Market with Three-Lane PCI Express Gen2 Switch, Adds Four-Lane Device to Industry’s Broadest Portfolio
PLX Technology, Inc. have announced the industry's only three-lane PCI Express® (PCIe®) Gen2 switch, and a new four-lane PCIe Gen2 switch, both of which are in the market's smallest 10x10mm QFN packaging. With samples available in early July, the PLX® ExpressLane™ PEX8603 (3 lanes, 3 ports) and PEX8605 (4 lanes, 4 ports) switches offer very low power requirements, down to 0.6W typical, have exclusive optional x1 and x2 port configurations, along with unique debug diagnostic circuitry backed by powerful free software tools.
PLX Achieves 300 Meter Reach with 10GBase-T Transceivers
PLX Technology, Inc. has announced it has successfully demonstrated 10Gbps Ethernet data and electrical transfer, in full compliance with the IEEE 802.3an standard, over a distance of 300 meters using typical, widely installed Cat6A unshielded twisted pair copper cable
Sequans Announces New WiMAX Chip for Handsets and Tablets
4G chipmaker Sequans introduced its newest Mobile WiMAX chip, the SQN1310, today at CTIA's Wireless 2011 annual trade show. The new chip leverages the architecture and software of Sequans' SQN1200 series technology while providing higher levels of integration, enabling a smaller design footprint and reduced system cost.
Industry Leading Wideband PLL with Integrated VCO
Hittite Microwave Corporation has introduced the HMC830LP6GE, an industry leading low noise, wide band, Fractional-N Phase-Locked-Loop (PLL) with integrated Voltage Controlled Oscillator (VCO). It is capable of generating continuous frequencies from 25 MHz to 3000 MHz. The HMC830LP6GE features industry leading phase noise and spurious performance across all frequencies, making it the best choice for applications that require excellent signal quality performance and high SNR
New Atheros SmartLink Technology Delivers Highest Performance for Powerline Connectivity
Atheros Communications, Inc. has announced SmartLink™, a new technology that enhances the performance and coverage of powerline technology by transferring data across all three electrical wires—line, neutral and ground. Analogous to Wi-Fi switched antenna diversity, this new offering increases data throughput and is able to deliver carrier-grade multiple HD video streams within a single home.
Atheros Introduces Industry’s Most Advanced Dual-Band, Dual-Stream Wi-Fi Chip for High Performance Audio Visual Consumer Experiences
AR9374 Chip Offers 2x2 Dual-Band 802.11n MIMO Solution and 40MHz Transmissions to Support High Data-Rate USB and Embedded CE Applications
